WEBINAR
Getting Technical: Low Pressure Molding & Its Newest Outdoor Innovation
Wednesday, February 11th
10 a.m.-11 a.m. Central
Join Bostik's electronics experts and our guest, LPMS USA, as we unpack the value of low pressure molding (LPM) for electronic parts encapsulation and unveil our newest innovation for outdoor applications: Thermelt® 964!
Register today for our upcoming webinar on Wednesday, February 11, 2026 at 10 a.m. CT.
Can’t make the date? Still register to receive the on-demand version. You won’t want to miss learning about:
- How LPM compares to other electronic parts encapsulation methods
- The value in Thermelt LPM resins
- How Thermelt 964 stands out in the market and helps you easily meet performance demands
Also, our guest speaker, Brian Betti, president of LPMS USA, will share with you:
- The value of their equipment for LPM
- How and why to use Thermelt 964
- Real-world success case when using Thermelt 964
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