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ON-DEMAND WEBINAR

Getting Technical: Low Pressure Molding & Its Newest Outdoor Innovation

Watch Bostik's electronics experts and our guest, LPMS USA, as we unpack the value of low pressure molding (LPM) for electronic parts encapsulation and unveil our newest innovation for outdoor applications: Thermelt^® 964! 

You won’t want to miss learning about: 

How LPM compares to other electronic parts encapsulation methods 
The value in Thermelt LPM resins 
How Thermelt 964 stands out in the market and helps you easily meet performance demands

Also, our guest speaker, Brian Betti, president of LPMS USA, will share with you: 

The value of their equipment for LPM 
How and why to use Thermelt 964 
Real-world success case when using Thermelt 964

Our Presenters and Guest

Connect with our experts on LinkedIn.

Christos Karadimas
Bostik Engineering Adhesives Regional Director

Sarah Dupe
Bostik Senior Engineer Durable Goods

Brian Betti
LPMS USA President