For over 40 years, Bostik’s Thermelt^® low pressure molding resins have been used to encapsulate and protect electronic devices across markets, offering key process, performance and sustainability attributes to help you easily address your goals and meet evolving application requirements. These advantages include:

• One-component formulation with low application temperature to streamline processes as well as reduce parts damage likelihood
• Resistance to harsh environments, solvents, temperatures and more to increase end-use product durability
• Up to 90% bio-based formulation to decrease environmental impact

Additionally, certain products have completed ISO certifications, have passed autoclave testing (up to 50 cycles) and are able to withstand alcohol wiping and quick immersion, increasing their versatile use in more electronic device applications.